Research Article

Genetic Algorithms and Particle Swarm Optimization Mechanisms for Through-Silicon Via (TSV) Noise Coupling

Table 1

Physical dimensions and material properties of the test vehicle.

ComponentValue (μm)ComponentValueComponentValue (μm)

16.510 S/mdTSV-TSV130
0.525.8 × 107 S/mpTSV-TSV250
10011.9