Review Article
Current Status of Magnetoelectric Composite Thin/Thick Films
Table 3
Summary of advantages/disadvantages of ME composite films with different connectivity.
| Connectivity | Advantage | Disadvantage | Remarks |
| 0-3 | Easy processing. | Low resistivity (difficult to pole). Low ME property. | Sintering with ceramic power mixture. Ceramic/polymer composite. |
| | Easy fabrication. High resistivity. Good ME property. | Interdiffusion. Thermal expansion mismatch. | Cofiring at high temperature. All ceramic materials. Tape casting. | 2-2 | High resistivity. Low-temperature processing. Coherent interface. Precise control of the lattice mismatching and thickness in the atomic scale. | Weak ME effect. | Thin film process layer by layer. Integrated ME devices. | | Easy fabrication. High resistivity. | Only bulk material. Low mechanical strength from epoxy bonding. | Epoxy bonding at room temperature. Ceramic/magnetic metal alloy. |
| 1-3 | Coherent interface in an atomic scale. | Low resistivity. Hard to fabricate. | Large in-plane strain. Thin film process. |
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