Table of Contents Author Guidelines Submit a Manuscript
Advances in Condensed Matter Physics
Volume 2018, Article ID 5483756, 6 pages
https://doi.org/10.1155/2018/5483756
Research Article

The TDDB Characteristics of Ultra-Thin Gate Oxide MOS Capacitors under Constant Voltage Stress and Substrate Hot-Carrier Injection

1State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China
2The Fifth Electronics Research Institute of Ministry of Industry and Information Technology, Guangzhou 510610, China
3Chengdu Technological University, Chengdu 611730, China

Correspondence should be addressed to Xue Fan; moc.liamxof@naf_x

Received 2 November 2017; Accepted 16 April 2018; Published 20 May 2018

Academic Editor: Faheem. K. Butt

Copyright © 2018 Jingyu Shen et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

The breakdown characteristics of ultra-thin gate oxide MOS capacitors fabricated in 65 nm CMOS technology under constant voltage stress and substrate hot-carrier injection are investigated. Compared to normal thick gate oxide, the degradation mechanism of time-dependent dielectric breakdown (TDDB) of ultra-thin gate oxide is found to be different. It is found that the gate current () of ultra-thin gate oxide MOS capacitor is more likely to be induced not only by Fowler-Nordheim (F-N) tunneling electrons, but also by electrons surmounting barrier and penetrating electrons in the condition of constant voltage stress. Moreover it is shown that the time to breakdown () under substrate hot-carrier injection is far less than that under constant voltage stress when the failure criterion is defined as a hard breakdown according to the experimental results. The TDDB mechanism of ultra-thin gate oxide will be detailed. The differences in TDDB characteristics of MOS capacitors induced by constant voltage stress and substrate hot-carrier injection will be also discussed.