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Advances in Materials Science and Engineering
Volume 2013 (2013), Article ID 123697, 11 pages
Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review
School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, 14300 Nibong Tebal, Penang, Malaysia
Received 9 October 2012; Revised 18 January 2013; Accepted 4 February 2013
Academic Editor: J. Paulo Davim
Copyright © 2013 Liu Mei Lee and Ahmad Azmin Mohamad. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
Citations to this Article [8 citations]
The following is the list of published articles that have cited the current article.
- Muhammad Ghaddafy Affendy, and Ahmad Azmin Mohamad, “Effects of Crosshead Speeds on Solder Strength of Cu/Sn-9Zn/Cu Lap Joints,” Journal of King Saud University - Engineering Sciences, 2013.
- Muhammad Firdaus Mohd Nazeri, Ahmad Badri Ismail, and Ahmad Azmin Mohamad, “Effect of polarizations on Sn-Zn solders alloys in alkaline electrolyte,” Journal of Alloys and Compounds, vol. 606, pp. 278–287, 2014.
- Liang Zhang, and K. N. Tu, “Structure and properties of lead-free solders bearing micro and nano particles,” Materials Science & Engineering R-Reports, vol. 82, pp. 1–32, 2014.
- Mrunali Sona, and K. Narayan Prabhu, “Assessment of Joint Reliability of Sn–2.5Ag–0.5Cu Solder/Cu as a Function of Reflow Time,” Transactions of the Indian Institute of Metals, 2015.
- Kuan-Jen Chen, Fei-Yi Hung, Truan-Sheng Lui, Li-Hui Chen, and Yu-Wen Chen, “A study of green Sn–xZn photovoltaic ribbons for solar cell application,” Solar Energy Materials and Solar Cells, vol. 143, pp. 561–566, 2015.
- Mrunali Sona, and K. Narayan Prabhu, “Spreading Behaviour and Joint Reliability of Sn-0.3Ag-0.7Cu Lead-Free Solder Alloy on Nickel Coated Copper Substrate as a Function of Reflow Time,” Transactions Of The Indian Institute Of Metals, vol. 68, no. 6, pp. 1027–1031, 2015.
- Tsung-Nan Tsai, and Mika Liukkonen, “Robust parameter design for the micro-BGA stencil printing process using a fuzzy logic-based Taguchi method,” Applied Soft Computing, 2016.
- Wislei R. Osório, and Amauri Garcia, “Interrelation of wettability–microstructure–tensile strength of lead-free Sn–Ag and Sn–Bi solder alloys,” Science and Technology of Welding and Joining, pp. 1–9, 2016.