Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

<table>Scheme of the interfacial reaction of SAC305/Cu during solder reflow: (a) dissolution of the Cu substrate, (b) supersaturation of the molten solder layer with Cu, (c) formation of the scallop-type Cu<sub>6</sub>Sn<sub>5</sub> at the interface, and (d) Cu<sub>3</sub>Sn emerges between Cu<sub>6</sub>Sn<sub>5</sub>/Cu with prolonged soldering.</table>

Advances in Materials Science and Engineering

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Figure 3

Figure 3: Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review 