Thermal and Cure Kinetics of Epoxy Molding Compounds Cured with Thermal Latency Accelerators

Table 3

Kinetic parameters for epoxy molding compounds catalyst by TPP and TPP-BQ.

Accelerator	𝑇 (°C)	𝑚	𝑛	𝑘1 (min^−1)	𝑘2; (min^−1)	𝐸𝑎1 (kJ mol^−1)	𝐸𝑎2; (kJ mol^−1)	ln 𝐴1	ln 𝐴2
	130	0.4	1.3	6.6	12.8
	150	0.4	1.4	6.5	61.7
TPP-BQ	165	0.5	1.0	20.2	129.4	18.3	11.6	16.5	13.3
	175	0.6	1.0	39.8	200.5
	185	1.3	1.1	114.8	330.8
	130	0.5	1.3	12.6	31.6
	150	0.5	1.3	16.5	102.9
TPP	165	0.6	1.4	45.5	189.3	12.6	9.6	12.9	12.3
	175	0.6	1.5	73.1	291.0
	185	0.5	1.5	110.9	476.9