Advances in Materials Science and Engineering / 2013 / Article / Fig 8

Research Article

Comparison of H2 and NH3 Treatments for Copper Interconnects

Figure 8

OM images of Cu hillocks (a) 30 s H2 plasma treatment; (b) 30 s NH3 plasma treatment.

Article of the Year Award: Outstanding research contributions of 2020, as selected by our Chief Editors. Read the winning articles.