Advances in Materials Science and Engineering / 2013 / Article / Fig 8

Research Article

Comparison of H2 and NH3 Treatments for Copper Interconnects

Figure 8

OM images of Cu hillocks (a) 30 s H2 plasma treatment; (b) 30 s NH3 plasma treatment.
825195.fig.008a
(a)
825195.fig.008b
(b)

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