Comparison of H<sub><b>2</b></sub> and NH<sub><b>3</b></sub> Treatments for Copper Interconnects

<table>OM images of Cu hillocks (a) 30 s H<sub>2</sub> plasma treatment; (b) 30 s NH<sub>3</sub> plasma treatment.</table>

Advances in Materials Science and Engineering

Figure 8: Comparison of H<sub><b>2</b></sub> and NH<sub><b>3</b></sub> Treatments for Copper Interconnects 