Table of Contents Author Guidelines Submit a Manuscript
Advances in Materials Science and Engineering
Volume 2013, Article ID 971790, 7 pages
http://dx.doi.org/10.1155/2013/971790
Research Article

Comparison of Microstructural and Morphological Properties of Electrodeposited Fe-Cu Thin Films with Low and High Fe : Cu Ratio

1Department of Elementary Education, Bartın University, 74100 Bartin, Turkey
2Department of Physics, Eskişehir Osmangazi University, 26480 Eskişehir, Turkey

Received 25 May 2013; Revised 12 August 2013; Accepted 27 August 2013

Academic Editor: Fu-Chien Chiu

Copyright © 2013 Umut Sarac and M. Celalettin Baykul. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Umut Sarac and M. Celalettin Baykul, “Comparison of Microstructural and Morphological Properties of Electrodeposited Fe-Cu Thin Films with Low and High Fe : Cu Ratio,” Advances in Materials Science and Engineering, vol. 2013, Article ID 971790, 7 pages, 2013. https://doi.org/10.1155/2013/971790.