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Advances in Materials Science and Engineering
Volume 2014, Article ID 606814, 10 pages
http://dx.doi.org/10.1155/2014/606814
Research Article

The Effects of Gallium Additions on Microstructures and Thermal and Mechanical Properties of Sn-9Zn Solder Alloys

1Department of Electronics Engineering and Computer Science, Tung Fang Design Institute, No. 110, Dong Fang Road, Hunei, Kaohsiung 82941, Taiwan
2Department of Aeronautics and Astronautics, Research Center for Energy Technology and Strategy, National Cheng Kung University, Tainan 70101, Taiwan
3Department of Electrical Engineering, National Chung Hsing University, Taichung 40227, Taiwan
4Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences, Kaohsiung 80778, Taiwan

Received 19 September 2013; Revised 10 December 2013; Accepted 12 December 2013; Published 22 January 2014

Academic Editor: Tao Zhang

Copyright © 2014 Kang I. Chen et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Kang I. Chen, Shou C. Cheng, Chin H. Cheng, Sean Wu, Yeu-L. Jiang, and Tsung-C. Cheng, “The Effects of Gallium Additions on Microstructures and Thermal and Mechanical Properties of Sn-9Zn Solder Alloys,” Advances in Materials Science and Engineering, vol. 2014, Article ID 606814, 10 pages, 2014. https://doi.org/10.1155/2014/606814.