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Advances in Materials Science and Engineering
Volume 2014, Article ID 608608, 8 pages
http://dx.doi.org/10.1155/2014/608608
Research Article

A Study of Parameters Related to the Etch Rate for a Dry Etch Process Using NF3/O2 and SF6/O2

1School of Electronics, Telecommunications and Computer Engineering, Korea Aerospace University, Goyang 412-791, Republic of Korea
2Department of Materials Science and Engineering, Korea Aerospace University, Goyang 412-791, Republic of Korea

Received 1 May 2013; Accepted 8 November 2013; Published 4 February 2014

Academic Editor: Mohd Sapuan Salit

Copyright © 2014 Seon-Geun Oh et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Seon-Geun Oh, Kwang-Su Park, Young-Jun Lee, Jae-Hong Jeon, Hee-Hwan Choe, and Jong-Hyun Seo, “A Study of Parameters Related to the Etch Rate for a Dry Etch Process Using NF3/O2 and SF6/O2,” Advances in Materials Science and Engineering, vol. 2014, Article ID 608608, 8 pages, 2014. https://doi.org/10.1155/2014/608608.