A Study of Parameters Related to the Etch Rate for a Dry Etch Process Using NF<sub>3</sub>/O<sub>2</sub> and SF<sub>6</sub>/O<sub>2</sub>

<table>(a) Etch rates of SF<sub>6</sub>/O<sub>2</sub> and NF<sub>3</sub>/O<sub>2</sub> and (b) optical emission intensity of fluorine for SF<sub>6</sub>/O<sub>2</sub> and NF<sub>3</sub>/O<sub>2</sub> as a function of pressure.</table>

Advances in Materials Science and Engineering

fig3

Figure 3

Figure 3: A Study of Parameters Related to the Etch Rate for a Dry Etch Process Using NF<sub>3</sub>/O<sub>2</sub> and SF<sub>6</sub>/O<sub>2</sub> 

Advances in Materials Science and Engineering

A Study of Parameters Related to the Etch Rate for a Dry Etch Process Using NF3/O2 and SF6/O2

Figure 3

A Study of Parameters Related to the Etch Rate for a Dry Etch Process Using NF₃/O₂ and SF₆/O₂