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Advances in Materials Science and Engineering
Volume 2014, Article ID 832308, 8 pages
http://dx.doi.org/10.1155/2014/832308
Research Article

Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites

1Applied Research Laboratory, The Pennsylvania State University, University Park, PA 168022, USA
2Momentive Performance Materials, 22557 Lunn Road, Strongsville, OH 44149, USA
3Department of Mechanical Engineering, The Pennsylvania State University, University Park, PA 16802, USA

Received 28 September 2014; Accepted 15 November 2014; Published 3 December 2014

Academic Editor: Bin Li

Copyright © 2014 A. Rape et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

A. Rape, X. Liu, A. Kulkarni, and J. Singh, “Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites,” Advances in Materials Science and Engineering, vol. 2014, Article ID 832308, 8 pages, 2014. https://doi.org/10.1155/2014/832308.