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Advances in Materials Science and Engineering
Volume 2015, Article ID 269167, 13 pages
Research Article

Study of Direct Bonding Ceramics with Metal Using Sn2La Solder

Faculty of Materials Science and Technology in Trnava, Slovak University of Technology in Bratislava, Paulínska 16, 917 24 Trnava, Slovakia

Received 23 September 2015; Revised 26 October 2015; Accepted 2 November 2015

Academic Editor: Wei Zhou

Copyright © 2015 Roman Koleňák and Igor Kostolný. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


The aim of this research was to study the direct bonding of ceramic materials, mainly Al2O3 and selected metals, with primary attention given to Cu substrate. Soldering was performed with Sn-based solder alloyed with 2% La. We found that the bond formation between Sn2La solder and Al2O3 occurs at the activation of lanthanum phases in solder by ultrasound. Lanthanum in the solder becomes oxidised in air during the soldering process. However, due to ultrasonic activation, the lanthanum particles are distributed to the boundary with ceramic material. A uniformly thin layer containing La, 1.5 µm in thickness, is formed on the boundary with Al2O3 material, ensuring both wetting and joint formation. The shear strength with Al2O3 ceramics is 7.5 MPa. Increased strength to 13.5 MPa was observed with SiC ceramics.