Advances in Materials Science and Engineering / 2015 / Article / Fig 3

Research Article

The Microstructures and Electrical Resistivity of (Al, Cr, Ti)FeCoNiOx High-Entropy Alloy Oxide Thin Films

Figure 3

The plan-view micrographs of the as-annealed (a) FCN film; (b) CFCN film; (c) AFCN film; and (d) TFCN film, respectively. The insets are the corresponding SAD (marked by DP) and DF image (marked by DF) of each as-annealed thin film.
(a)
(b)
(c)
(d)