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Advances in Materials Science and Engineering
Volume 2016 (2016), Article ID 9265195, 15 pages
Review Article

Properties and Microstructures of Sn-Bi-X Lead-Free Solders

1School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou 221116, China
2Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
3State Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001, China

Received 29 June 2016; Revised 18 October 2016; Accepted 23 October 2016

Academic Editor: Peter Majewski

Copyright © 2016 Fan Yang et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Fan Yang, Liang Zhang, Zhi-quan Liu, Su-juan Zhong, Jia Ma, and Li Bao, “Properties and Microstructures of Sn-Bi-X Lead-Free Solders,” Advances in Materials Science and Engineering, vol. 2016, Article ID 9265195, 15 pages, 2016. doi:10.1155/2016/9265195