Thermal Analysis of Si/GaAs Bonding Wafers and Mitigation Strategies of the Bonding Stresses

Table 1

Radial normal stresses away from the edge region of the bonding interfaces with different radii.

Radii (mm)	5	10	20	30	40	50
Radial normal stresses (MPa)
Lower surface of Si
Upper surface of GaAs	71.5	71.6	71.5	71.6	71.5	71.5