Journals
Publish with us
Publishing partnerships
About us
Blog
Advances in Materials Science and Engineering
Journal overview
For authors
For reviewers
For editors
Table of Contents
Special Issues
Advances in Materials Science and Engineering
/
2017
/
Article
/
Tab 1
/
Research Article
Thermal Analysis of Si/GaAs Bonding Wafers and Mitigation Strategies of the Bonding Stresses
Table 1
Radial normal stresses away from the edge region of the bonding interfaces with different radii.
Radii (mm)
5
10
20
30
40
50
Radial normal stresses (MPa)
Lower surface of Si
Upper surface of GaAs
71.5
71.6
71.5
71.6
71.5
71.5