Research Article

Thermal Analysis of Si/GaAs Bonding Wafers and Mitigation Strategies of the Bonding Stresses

Table 1

Radial normal stresses away from the edge region of the bonding interfaces with different radii.

Radii (mm)51020304050

Radial normal stresses (MPa)
 Lower surface of Si
 Upper surface of GaAs71.571.671.571.671.571.5