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Advances in Materials Science and Engineering
Volume 2017, Article ID 9750323, 7 pages
https://doi.org/10.1155/2017/9750323
Research Article

Effect of Ga on the Inoxidizability and Wettability of Sn-0.5Ag-0.7Cu-0.05Pr Solder

1College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
2School of Materials Science and Engineering, Nanjing University of Science and Technology, Nanjing 210016, China

Correspondence should be addressed to Xue Songbai; nc.ude.aaun@bseux

Received 27 May 2017; Accepted 21 June 2017; Published 10 September 2017

Academic Editor: Patrice Berthod

Copyright © 2017 Xu Jiachen et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

The effect of trace amount of Ga on the inoxidizability and wettability of Sn-0.5Ag-0.7Cu-0.05Pr solders was investigated systematically by means of microstructure characterizations. The results indicate that the wettability and oxidation resistance properties are remarkably improved with addition of trace amount of Ga. Moreover, it is observed that the trace amount of Ga in Sn-0.5Ag-0.7Cu-0.05Pr solders refines the matrix microstructure. The relationship between wettability and oxidation resistance was put into deep study. And Ga was found to be enriched on the surface of the molten solder, which benefited the properties correspondingly. The results of this study can stimulate the use of low-silver Sn-Ag-Cu-Pr solders for various applications.