Research Article
Effect of Indium Additions on the Formation of Interfacial Intermetallic Phases and the Wettability at Sn-Zn-In/Cu Interfaces
Figure 1
Wetting angle (a) and spreading area (b) of 0.5 g liquid Sn-Zn-In () on copper substrate: (a) 250°C, 3–60 min, (b) 230–370°C, 8 min.
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(b) |