Effect of Indium Additions on the Formation of Interfacial Intermetallic Phases and the Wettability at Sn-Zn-In/Cu Interfaces

Figure 4

Interfacial microstructure of Sn-Zn-1.5% In/Cu couples, = 250°C, reflow time: (a) 3 min, (b) 15 min, and (c) 30 min.

(a)

(b)

(c)