Effect of Power Cycling and Heat Aging on Reliability and IMC Growth of Sn-5Sb and Sn-10Sb Solder Joints

<table class="table-group" id="tab1"><tr><td><table class="table"><tr><td class="thead-hr" colspan="3"><hr/></td></tr><tr class="thead"><td class="align_left">Chemical compositions (mass%)</td><td class="align_center">Solidus temperature (°C)</td><td class="align_center">Melting finish temperature (°C)</td></tr><tr><td class="thead-hr" colspan="3"><hr/></td></tr><tr><td class="align_left">Sn-5Sb</td><td class="align_center">240</td><td class="align_center">248</td></tr><tr><td class="align_left">Sn-10Sb</td><td class="align_center">248</td><td class="align_center">254</td></tr><tr class="table-tr"><td colspan="3"><hr class="tbody-hr"/></td></tr></table></td></tr></table>

<div>Melting properties of solder investigated.</div>

Advances in Materials Science and Engineering

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Table 1

Table 1: Effect of Power Cycling and Heat Aging on Reliability and IMC Growth of Sn-5Sb and Sn-10Sb Solder Joints 