Research Article
Study on Surface Hardness and Microstructure of Pure Copper Chip Strips Prepared by LSEM
Table 3
Mechanical and thermal constants of pure copper.
| | Young’s modulus (MPa) | Poisson’s ratio (MPa) | Thermal conductivity (N/sec/mm/C) | Heat capacity (J·Kg−1·K−1) | Emissivity |
| | 105000 | 0.33 | 122.61 | 3.16 | 0.7 |
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