Microstructure, Mechanical, and Electrical Properties and Corrosion Analysis of Lead-Free Solder CSI Joints on Cu Substrate Using Novel Concentrated Solar Energy Soldering (CSES) Method

Table 1

Solder details.

	Sn (wt.%)	Cu (wt.%)	Ag (wt.%)	Pb (wt.%)
SAC305	96.5	0.5	3	—
SACX0307	99	0.7	0.3 and X alloys	—
99C	99.3	0.7	—	—
SnPb	63	—	—	37