Microstructure, Mechanical, and Electrical Properties and Corrosion Analysis of Lead-Free Solder CSI Joints on Cu Substrate Using Novel Concentrated Solar Energy Soldering (CSES) Method

Table 3

Bending/flexural strength of CSES and CSI solder joints (before and after corrosion).

Solder material	CSES (before corrosion)		CSI (before corrosion)		CSES (after corrosion)		CSI (after corrosion)
	Bending strength (MPa)	Std devi.	Bending strength (MPa)	Std devi.	Bending strength (MPa)	Std devi.	Bending strength (MPa)	Std devi.
SAC305	48.894	1.1323	48.294	1.1843	41.539	1.5523	40.002	1.2723
SACX0307	36.973	1.1743	36.73	1.9943	31.442	1.3943	30.942	1.3943
99C	34.629	1.2133	33.211	1.4333	28.381	1.5433	27.691	1.4633
SnPb	46.762	1.2763	45.523	1.4863	38.482	1.5363	36.839	1.4863