Microstructure, Mechanical, and Electrical Properties and Corrosion Analysis of Lead-Free Solder CSI Joints on Cu Substrate Using Novel Concentrated Solar Energy Soldering (CSES) Method

Table 5

Electrical resistivity of CSES and CSI solder joints (before and after corrosion).

Solder material	CSES (before corrosion)		CSI (before corrosion)		CSES (after corrosion)		CSI (after corrosion)
	Elect. resisti. (μΩ·cm)	Std devi.	Elect. resisti. (μΩ·cm)	Std devi.	Elect. resisti. (μΩ·cm)	Std devi.	Elect. resisti. (μΩ·cm)	Std devi.
SAC305	0.001944	1.17E − 05	0.001958	1.24E − 05	0.001987	1.25E − 05	0.001999	1.23E − 05
SACX0307	0.001959	1.17E − 05	0.001966	1.26E − 05	0.001991	1.28E − 05	0.002014	1.25E − 05
99C	0.001969	1.18E − 05	0.001989	1.28E − 05	0.002006	1.29E − 05	0.002016	1.27E − 05
SnPb	0.002011	1.19E − 05	0.002024	1.29E − 05	0.002048	1.30E − 05	0.002066	1.30E − 05
Cu substrate	0.00171		0.00171		0.00171		0.00171