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International Journal of Power Management Electronics
Volume 2008 (2008), Article ID 678415, 9 pages
http://dx.doi.org/10.1155/2008/678415
Research Article

On-Chip Bondwire Magnetics with Ferrite-Epoxy Glob Coating for Power Systems on Chip

School of Electrical Engineering and Computer Science, University of Central Florida, Orlando, FL 32816, USA

Received 3 January 2008; Accepted 13 May 2008

Academic Editor: Ty McNutt

Copyright © 2008 Jian Lu et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Jian Lu, Hongwei Jia, Andres Arias, Xun Gong, and Z. John Shen, “On-Chip Bondwire Magnetics with Ferrite-Epoxy Glob Coating for Power Systems on Chip,” International Journal of Power Management Electronics, vol. 2008, Article ID 678415, 9 pages, 2008. doi:10.1155/2008/678415