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ElectroComponent Science and Technology
Volume 1, Issue 2, Pages 103-112
http://dx.doi.org/10.1155/APEC.1.103

Future Development of Electronic Components

Corporate Staff Development, Electronic Components and Materials Division, N. V. Philips Gloeilampfenfabrieken, Eindhoven, The Netherlands

Received 1 January 1974; Accepted 13 May 1974

Copyright © 1974 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

The rapid progress of semiconductor products in the electronic industry over the past two decades in the group of active components has not been matched by an equal progress of the passive components. Integration has blurred the traditional boundary between components and circuits. With integration penetrating deeper and deeper into electronic circuitry the connecting methods of the IC with the rest of the system becomes a cost and quality determining factor of prime importance. It is stressed that connecting methods of the other, passive components have to be compatible with the connecting method of the IC.