Active and Passive Electronic Components

Active and Passive Electronic Components / 1975 / Article

Open Access

Volume 2 |Article ID 969518 | 9 pages | https://doi.org/10.1155/APEC.2.45

Field Assisted Glass Sealing

Received20 Mar 1974

Abstract

The paper reviews the experimental, theoretical and applications work by several authors on a glass sealing technique which was announced five years ago. In the process, an electrostatic field is utilized to promote bonding at relatively low temperatures. The process variables and seal properties are described in detail. A discussion is presented of the mechanisms which are believed to play a role in bond formation. As an example of the utility of the technique, its highly successful application to the mounting of strain gauges is described.

Copyright © 1975 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


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