Abstract
The paper reviews the experimental, theoretical and applications work by several authors on a glass sealing technique which was announced five years ago. In the process, an electrostatic field is utilized to promote bonding at relatively low temperatures. The process variables and seal properties are described in detail. A discussion is presented of the mechanisms which are believed to play a role in bond formation. As an example of the utility of the technique, its highly successful application to the mounting of strain gauges is described.