TY - JOUR AU - Carpenter, R. PY - 1976 DA - 1900/01/01 TI - A System for Depositing Tungsten Coatings Suitable for an Electrical Contact Application SP - 106174 VL - 3 AB - SN - 0882-7516 UR - https://doi.org/10.1155/APEC.3.13 DO - 10.1155/APEC.3.13 JF - ElectroComponent Science and Technology PB - Hindawi Publishing Corporation KW - ER -