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ElectroComponent Science and Technology
Volume 5 (1978), Issue 1, Pages 55-59

The Structure and Properties of Reactively Bonded Thick Film Gold Conductors

Standard Telecommunication Laboratories Ltd., London Road, Harlow, UK

Received 20 October 1977

Copyright © 1978 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


The properties of reactively bonded gold conductors have been compared with a fritted gold conductor (DuPont 9260). Several different additives in the gold conductors were examined, including copper/copper oxide; copper plus cadium/germanium and copper cadium and bismuth.

The adhesion strength of all the conductors was found to be superior to the fritted standard, but the electrical conductivity did not appear to be improved. These materials thus offer advantages where stronger adhesion is required or possibly, where the interface between conductor and substrate needs to be well-defined.