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ElectroComponent Science and Technology
Volume 5, Issue 4, Pages 205-207

New Crossovers Using a Combined Film Technique

Siemens AG, Unternehmensbereich Bauelemente, München, Germany

Received 24 April 1978

Copyright © 1979 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


This paper was presented at the IEEE Committee for Passive Components and their Materials International Conference on Thin and Thick Film Technology, held at Augsburg, 28–30 September 1977.