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ElectroComponent Science and Technology
Volume 9 (1981), Issue 1, Pages 87-92
http://dx.doi.org/10.1155/APEC.9.87

Reliability Considerations of Flip Chip Components for Automotive Electronic Applications

Sanken Electric Co. Ltd., Microelectronics Division, 677 Onohara Shimoakasaka, Saitama, Kawagoe, Japan

Copyright © 1981 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Keisuke Sugiyama, Isao Bansaku, Naoharu Tsuzimoto, and Iwao Tachikawa, “Reliability Considerations of Flip Chip Components for Automotive Electronic Applications,” ElectroComponent Science and Technology, vol. 9, no. 1, pp. 87-92, 1981. doi:10.1155/APEC.9.87