Abstract
High grade quality in fine-line printability, non-porosity of fired film and adhesion to substrate is required for gold conductor pastes applicable to multilayer or high density circuit. Many kinds of gold pastes were made by the changing of types and contents of main components such as gold powder, glass frit and organic vehicle. The important properties of the fired samples of the above pastes on alumina substrate and fired dielectric pastes were compared.Gold paste of the mixed bond type was recognized as superior in adhesion to alumina substrate, while that of the fritless type was found superior in adhesion to the fired dielectric paste and wire bondability. It is possible to print line of 70 μm width and spacing by using these gold pastes. If suitable printing conditions including screen are chosen, even 50 μm line width and spacing can be made. Non-porosity measured by means of the back light porosity test and low resistivity of the samples met the requirement for the high density circuit.In this paper, various properties of the above mentioned gold pastes which are most suitable to two different type substrates will be described. Also the relation between the properties and compositions of the samples will be discussed.