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ElectroComponent Science and Technology
Volume 8 (1981), Issue 3-4, Pages 235-239

Combination of Thick-Film Dielectric/Thin Film Conductor for Fine Pattern Formation of Multi-Layer Substrate

1NEC-Toshiba Information Systems Inc., Sumitomo Mita Bld. 37–8, 5-Chome, Shiba, Minatoku, Tokyo 108, Japan
2Nippon Electric Co., Ltd., 10, 1-Chome Nisshin-cho, Fuchu City, Tokyo 183, Japan

Copyright © 1981 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


Presented in this paper is a realization of Multi-Layer Substrate with 30 μm signal pattern width and 100 μm square via holes on a 100 mm square ceramic substrate. To obtain this fine signal pattern width, a thin film technique, “GSP” process, has been applied on a thick film dielectric layer. For the 100 μm square via holes through the thick film dielectric, a new thick film technique, “DD” process, has been developed utilizing a photolithographic technique. This paper describes the processes and the results obtained by the method.