Abstract
This paper describes the critical factors required for the solder paste process and its applications to Hybrid Circuits (Solder Paste Process). It also describes the fine solder printing of substrate pads for flip chip IC and the simultaneously thick printing of solder paste for chip capacitors and/or other parts.Through this “Solder Paste Process”, assemblies of good quality and higher yields are achieved. The results of various evaluation and reliability tests were excellent. From this study, some new applications of solder paste are presented.