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ElectroComponent Science and Technology
Volume 10, Issue 1, Pages 31-49

Multi-Chip Module Technology

IBM Corporation, Hopewell Junction, NY, USA

Received 6 January 1982; Accepted 22 March 1982

Copyright © 1982 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

R. A. Rinne and D. R. Barbour, “Multi-Chip Module Technology,” ElectroComponent Science and Technology, vol. 10, no. 1, pp. 31-49, 1982.