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ElectroComponent Science and Technology
Volume 10, Issue 1, Pages 23-29

An Original Interconnection Technique for an Electronic Payment Card

Laboratoires d'Electronique et de Physique Appliquée 3, avenue Descartes, Limeil-Brévannes 94450, France

Received 12 November 1981; Accepted 3 March 1982

Copyright © 1982 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


This paper intends to illustrate, through a practical application, the possibilities of LEP foil flexible circuitry for mounting and interconnecting integrated circuits. This technique results in a high density packaging which is used here for the integration of two components, a microprocessor and a memory, in an electronic payment card.