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ElectroComponent Science and Technology
Volume 10, Issue 1, Pages 13-21

Surface Mounting of Leadless Chip Carriers on Various Printed Circuit Board Type Substrates

Exacta Circuits Limited, Selkirk, Scotland

Received 12 November 1981; Accepted 5 March 1982

Copyright © 1982 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


The effect of extended thermal cycling on the reliability of joints between ceramic leadless chip carriers and various printed circuit board type substrates is examined. Test results indicate success in using ceramic leadless chip carriers on some styles of PCB.