Surface Mounting of Leadless Chip Carriers on Various Printed Circuit Board Type Substrates

Lang, I. G.

doi:https://doi.org/10.1155/APEC.10.13

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Volume 10 | Article ID 607536 | https://doi.org/10.1155/APEC.10.13

Surface Mounting of Leadless Chip Carriers on Various Printed Circuit Board Type Substrates

I. G. Lang¹

Received12 Nov 1981

Accepted05 Mar 1982

Abstract

The effect of extended thermal cycling on the reliability of joints between ceramic leadless chip carriers and various printed circuit board type substrates is examined. Test results indicate success in using ceramic leadless chip carriers on some styles of PCB.

Copyright

Copyright © 1982 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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