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ElectroComponent Science and Technology
Volume 10 (1983), Issue 2-3, Pages 171-176

Computer Simulation of Hybrid Integrated Circuits Including Combined Electrical and Thermal Effects

Arizona State University, Tempe 85287, Arizona, USA

Accepted 26 October 1981

Copyright © 1983 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


This paper describes the application of a modern general purpose network analysis programme SPICE2 for the electrothermal analysis of hybrid integrated circuits. Self thermal coupling effects are modelled using the non-linear dependent current and voltage source capability in this programme, together with thermal environment parameters obtained from a three-dimensional thermal analysis program. Although numerical results are given by a bipolar transistor, the method is also applicable to monolithic integrated circuits and to resistors with variable temperature coefficients as power dissipating elements.