Active and Passive Electronic Components

Active and Passive Electronic Components / 1983 / Article

Open Access

Volume 10 |Article ID 284593 | https://doi.org/10.1155/APEC.10.157

J. P. Ramy, R. Schnitzler, C. Thebault, "Experimental and Theoretical Characterization of Thick and Thin Films for Microwave Uses on 99.6% Alumina Substrates", Active and Passive Electronic Components, vol. 10, Article ID 284593, 6 pages, 1983. https://doi.org/10.1155/APEC.10.157

Experimental and Theoretical Characterization of Thick and Thin Films for Microwave Uses on 99.6% Alumina Substrates

Received03 Oct 1981
Accepted02 Nov 1981

Abstract

In a previous paper,1 we showed, with a microwave quality factor (Q) measurement, that in the X band and with alumina substrates, thick film losses are not worse than thin film losses when the inks are screened then etched, and when they have copper oxide as adhesive layer and gold or copper as metal powder.Here, we extend this study to show that, our experimental results being in good agreement with theory, a simple D.C. resistivity measurement is sufficient to characterize these MIC'S metallizations and is as suitable as a microwave Q measurement. We also show that the nature of the ground plane cannot be neglected.

Copyright © 1983 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


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