Active and Passive Electronic Components

Active and Passive Electronic Components / 1983 / Article

Open Access

Volume 10 |Article ID 586821 | https://doi.org/10.1155/APEC.10.269

P. L. L. M. Derks, "Parameters That Influence the Ultrasonic Bond Quality", Active and Passive Electronic Components, vol. 10, Article ID 586821, 7 pages, 1983. https://doi.org/10.1155/APEC.10.269

Parameters That Influence the Ultrasonic Bond Quality

Received05 Jun 1981
Accepted26 Jun 1982

Abstract

This paper summarizes some non-destructive ultrasonic bond quality test methods. Systems described in the literature are mainly based on monitoring the deviation of the vibration amplitude during welding and the correlation between the bond strength with these deviations. Practical application of these principles can give discouraging results. A better understanding of the bond formation process should enable one to understand what causes the amplitude to deviate, and why this is strongly dependent on the ultrasonic bond system involved.

Copyright © 1983 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


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