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ElectroComponent Science and Technology
Volume 10 (1983), Issue 4, Pages 269-275

Parameters That Influence the Ultrasonic Bond Quality

Centre for Technology, N.B. Philips' Gloeilampenfabrieken, Eindhoven, The Netherlands

Received 5 June 1981; Accepted 26 June 1982

Copyright © 1983 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


This paper summarizes some non-destructive ultrasonic bond quality test methods. Systems described in the literature are mainly based on monitoring the deviation of the vibration amplitude during welding and the correlation between the bond strength with these deviations. Practical application of these principles can give discouraging results. A better understanding of the bond formation process should enable one to understand what causes the amplitude to deviate, and why this is strongly dependent on the ultrasonic bond system involved.