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ElectroComponent Science and Technology
Volume 11, Issue 1, Pages 1-20
http://dx.doi.org/10.1155/APEC.11.1

New Thick-Film Microwave Elements for Microwave Integrated Circuits

1Microelectronics Department, Institute of Electronics Mining, Metallurgical University, ul. Czarnowiejska 78, Kradów 30-054, Poland
2Tokyo Institute of Technology, Japan

Received 6 May 1981; Accepted 12 August 1982

Copyright © 1983 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Janusz J. Gondek, Marek A. Wójcicki, and Jan Cąber, “New Thick-Film Microwave Elements for Microwave Integrated Circuits,” ElectroComponent Science and Technology, vol. 11, no. 1, pp. 1-20, 1983. https://doi.org/10.1155/APEC.11.1.