Kanji Otsuka, Tamotsu Usami, "Design of a 108 Pin VLSI Package With Low Thermal Resistance", Active and Passive Electronic Components, vol. 10, Article ID 691950, 6 pages, 1983. https://doi.org/10.1155/APEC.10.311
Design of a 108 Pin VLSI Package With Low Thermal Resistance
The design of a 108 pin VLSI package is described. The package has low thermal resistance and can, therefore, dissipate 4 watts of power. The package design is now being used commercially in high-end computers made by Hitachi.
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