Table of Contents Author Guidelines Submit a Manuscript
ElectroComponent Science and Technology
Volume 10, Issue 4, Pages 209-216

Versatile Packaging Concept Using Thick Film Hybrids for Analog and Digital Circuits

Hasler AG, Bern, Switzerland

Received 5 June 1981; Accepted 26 June 1982

Copyright © 1983 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


The design parameters of a packaging concept are described, which allows the realization of a complex electronic module in a closed casing using commercially available components. These are soldered to multilayer thick-film circuits, mounted on metallic heat sinks. The multi-layer structure contains silver bearing conductors and supports trimmable resistors. The information presented concerns mainly the fabrication of the thick-film circuits and the thermal design.