Description and Performance of a Novel Concept “Single Level” Ceramic Chip Carrier
Two different designs of ceramic chip carriers are discussed. A carrier capable of being hermetically sealed has been developed which uses a glass seal combined with an epoxy bonded chip. A second carrier which does not have hermeticity has also been designed in which the alumina cap is attached to the base with a thermo setting resin. The applicability of these two types is examined.
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