Active and Passive Electronic Components

Active and Passive Electronic Components / 1983 / Article

Open Access

Volume 10 |Article ID 815395 | 5 pages |

Description and Performance of a Novel Concept “Single Level” Ceramic Chip Carrier

Received05 Nov 1981
Accepted13 Aug 1982


Two different designs of ceramic chip carriers are discussed. A carrier capable of being hermetically sealed has been developed which uses a glass seal combined with an epoxy bonded chip. A second carrier which does not have hermeticity has also been designed in which the alumina cap is attached to the base with a thermo setting resin. The applicability of these two types is examined.

Copyright © 1983 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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