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ElectroComponent Science and Technology
Volume 10, Issue 2-3, Pages 111-127
http://dx.doi.org/10.1155/APEC.10.111

Mounting of Micropackages in Vapour Phase Soldering and Study of Ageing Mechanism

1Thomson-CSF. CIMSA, 10-12 av. de l' Europe, Velizy 78140, France
2EFCIS, av. de l' Europe, Velizy 78140, France

Received 1 October 1981; Accepted 11 November 1981

Copyright © 1983 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Christian M. Val and Jacques D. Agniel, “Mounting of Micropackages in Vapour Phase Soldering and Study of Ageing Mechanism,” ElectroComponent Science and Technology, vol. 10, no. 2-3, pp. 111-127, 1983. https://doi.org/10.1155/APEC.10.111.