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ElectroComponent Science and Technology
Volume 11, Issue 3, Pages 219-223
http://dx.doi.org/10.1155/APEC.11.219

Examination of Thick-Films Using Modern Surface Analytical Techniques

Industrial Research Institute for Electronics, Technical University, Budapest, Hungary

Received 1 November 1982; Accepted 6 June 1983

Copyright © 1984 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

Modern surface analytical methods/EMPA, AES, SIMS etc. were used for studying the different layers in thick-film integrated circuits. Diffusion and migration effects, surface impurity distributions and surface compositions were examined. Some of the results are presented in this paper. Electrical measurements are not discussed here; only examples of the practical use of the methods are demonstrated.