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ElectroComponent Science and Technology
Volume 11 (1984), Issue 2, Pages 97-108
http://dx.doi.org/10.1155/APEC.11.97

Mid-Film Interconnects for Multilayer Microcircuit Packages

1Bell-Northern Research, Ottawa, Ontario, Canada
2Ontario Hydro – CNTD, 595 Bay Street, M5G 2C2, Toronto, Ont., Canada

Received 21 September 1982; Accepted 1 March 1983

Copyright © 1984 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

R. Sue and H. M. Naguib, “Mid-Film Interconnects for Multilayer Microcircuit Packages,” ElectroComponent Science and Technology, vol. 11, no. 2, pp. 97-108, 1984. doi:10.1155/APEC.11.97