Active and Passive Electronic Components

Active and Passive Electronic Components / 1984 / Article

Open Access

Volume 11 |Article ID 808925 | https://doi.org/10.1155/APEC.11.197

P. Trägner, "The Use of the Non-Contacting Temperature Measuring Techniques in the Early Detection of Hidden Faults in Electronic Components", Active and Passive Electronic Components, vol. 11, Article ID 808925, 5 pages, 1984. https://doi.org/10.1155/APEC.11.197

The Use of the Non-Contacting Temperature Measuring Techniques in the Early Detection of Hidden Faults in Electronic Components

Received01 Nov 1982
Accepted12 Jul 1983

Abstract

One of the reasons for a reduction of production quality is the so-called ‘hidden faults’, i.e. defects which will not be detected by the available testing equipment in spite of measures for ensuring a good quality. These testing methods, which are mostly electrical, can be supplemented in a suitable way by non-contacting temperature measuring techniques, since the variation of temperature as a function of operating conditions and environment constitutes one of the most important problems in the design of electronic components and sub-assemblies, and of their reliability.In this paper a relation is presented between a qualitative diagnostic model, reserve stability and other characteristics, on the one hand, and the permissible thermal energy that can be radiated, on the other hand, which facilitates the detection of hidden faults.

Copyright © 1984 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


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